Screaming Circuits Published

Published articles on technology trends and design challenges

• The Changing Role of OEM Product Development Engineering Teams: Circuits Assembly
• Leading Edge Technology...: Product Design & Development 
• Setting the Pace for Fast Turns: U.S. Tech
• Black Pad - and then some; SMT magazine (Please note that at the end of the 5th paragraph, I say that "the solder cannot mix and adhere to the tin" causing Black Pad. It's actually the nickle, not tin, that the solder can't mix with. Oops.)
• QFN "how-to" tutorial; EE-Times Wireless Net Design Line
• RoHS in four easy steps; EDN