Screaming Circuits: Parts Form-factors

PROTOTYPE AND SMALL VOLUME
PCB ASSEMBLY MADE EASY

Check Again.

How do you know? How do you know what? It could be how do you know if that new restaurant has good food, or how do you know that the car you're about to buy isn't a lemon. It could... Read more

Favorites

What's your favorite MCU package and why? The DIP is big and easy to use. You can stick it in a breadboard (wireless or soldered), a socket or easily hand solder it. But, it tends to be more expensive and... Read more

Package Variants

Here's another issue we see from time to time involving the old, familiar, 0.1" pitch headers. When initially laying out the board, the footprint for the break-away header is used. It's small and easy to use. The headers are cheap... Read more

And The Race Goes On

The race for the smallest part is still going strong. That and the fact that basic logic gates are still with us is affirmed quite well with a new set of chips from NXP. The 74AUP2G00 is a dual two-input... Read more

Picking Packages

A long, long time ago, in a place pretty close to here, picking a form factor was easy. Your CPU came in a 40 pin DIP. Your logic came in 14 or 16 bit dips. You picked resistor sizes based... Read more

Who's Right?

Jack commented on my prior post, An Unanswered Question. His point was that instead of just saying "check with the manufacturer's datasheet", like I so often suggest when talking about land patterns, I should give more credit to the IPC... Read more

Hot Time in the Small Chips Tonight

Years ago when I worked for a local projector company, we were introducing a relatively compact projector lighted by a Halogen lamp. Cooling such bulb in a big, wide open projector wasn't a problem, but we barely had a few... Read more

BGA Woes

Quite a few of the new chips I see coming out stick to the BGA or QFN form-factor. Sometimes they'll be referred to as WSP (wafer scale package) or CSP (chip scale package), but those are still just little BGAs.... Read more

A Bit More On the LGA

After my last post about LGA land patterns, I received a couple of questions asking for more detail in a few areas. "The LinearTech LGA apnote (LTM46xx series) shows planes on the mounting layer interconnecting pads that are solder mask... Read more

Et Tu Embedded Passives

I don't know if or when embedded passives will become the "next big thing" in PCB design, but they are on the way. We, at Screaming Circuits, have been asked about the use of embedded passives a few times. The... Read more