Screaming Circuits: Screaming Circuits Component Manufacturability Index

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Screaming Circuits Component Manufacturability Index

Screaming Circuits Manufacturability Index

Ranks the difficulty of assembling a component. Index is one to five, with one being easiest, and five being the most complex

Sub index: a, b, c

    a: Not a challenge within the number rank
    b: Typical level of challenge within the number rank 
    c: Fits in the ranking, but likely needs special process, fixtures or attention

1: Just about anyone could hand solder the part
Examples: Thru-hole parts

2: Surface mount. Should be machine placed, but big enough to hand solder
Examples: 0805 or larger surface mount passives, SOIC packages

3: Pretty much any grade of surface mount equipment can handle this component
Examples: TSSOP or larger, 0.8mm pitch BGAs

4: Needs advanced automated assembly techniques
Examples: 0.4mm pitch BGAs or QFNs, CSP (chip scale package) or WSP (wafer scale package) BGAs, 0201 size passives, Package on Package (POP)

5: More or less R&D at this point. Few companies have or will assemble this part
Examples: 0.3mm pitch micro BGA, 1,700+ ball BGAs, 01005 passives

Just about everything 4b, and below are routinely within Screaming Circuits standard (guaranteed) process. 4c, 5a, 5b, 5c, are becoming more common here. These are special process (falling outside of our guarantee), but we can usually do a good job with them. You'll need to speak with a manufacturing engineer before placing the order.

Duane Benson
a colossal negative space wedgie of great power coming right at us at warp speed
Readings are off the scale, captain

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