PCB123 QFN 28 footprint
First things first. I still haven't received the little ZigBee modules. Microchip said they'd ship out on the 14th so I shouldn't expect any different. I'm going ahead and getting started on the schematic anyway.
When I get the modules, I'll probably write the code and try them out on an old PIC board that I designed and built a while back. But eventually, I want a nice small integrated package so that means a new schematic and layout. I have the schematic partially done in another CAD package, but I'm rolling with Sunstone's PCB123 this time.
The first thing to do is start looking at the components. I expect the footprints will be there for all of the passives, but given that PCB123 V3 is fairly new, I would also expect that some of the more complex parts won't be there. I'm tackling the PIC 18F2321 in a QFN28 package first. It will be a good opportunity to see if I can follow my own advice and make an easily and reliably manufacturable library component.
Most of it will be easy, but I will likely put some vias in the center pad area. I'll mask them properly. I'll also make sure that I create a proper paste stencil area. It's a 6x6x0.9 mm, 28 lead QFN package. The datasheet has the basic outline, but it also references a more detailed packaging specification on the Microchip website. I'll go there and get as much footprint information as they have.
Of course, even there I can find room for confusion. Microchip lists eight 28-Lead QFN footprints. Ugh. Just to be clear, this is the 6x6x0.9 mm with .40 mm contact length. Page 135. Ironically, the page in that detailed specification is the same one as in the datasheet and it even uses the same "For the most current package drawings..." statement referring to it's self. And no where in this 192 page document could I find anything on the paste layer. I'll segment the paste opening in the middle pad and shoot for about 50% coverage.
You must go here to be told to go there