Even smaller

As if QFNs and MicroBGAs aren't small enough, I ran across an article about a new package that will deliver 0.3mm or smaller pitch interconnects. We regularly place .5mm pitch BGAs and have done a few even smaller, but this is really getting down there.

The new package is primarily targeted at parts for mobile devices like DRAM, Flash and logic + memory. I don't think the package is available yet, but it is a continuation of the trend to smaller packages.

Duane Benson