QFN solder voids
With larger QFN parts, the opposite problem can occur in the center pad area. When the square opening for the solder paste stencil is fully open on a larger part – say 10 x 10 mm or larger – the paste squeegee may deform and actually scoop too much of the paste out of the opening. This can lead to uneven paste and solder voids. Both are potential reliability problems.
The solution is the same. Segment the stencil opening to create an even paste distribution.
Squeegees aren't just for window cleaning